Atotech has developed the advanced PallaBond process, which allows the direct deposition of palladium on copper, without using any nickel and offers two to three times more production capacity because of shorter deposition times compared to Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG).
PallaBond, an autocatalytic palladium final finish, is a future generation high-end finish with excellent solderability as well as high frequency and low signal loss attributes. It has excellent wire bonding credentials, providing very good bonding capability with gold and silver wires, as well as proven bonding capabilities with copper- and copper-palladium wires. The process is suitable for high frequency and key press applications, providing maximum fine feature resolution and definition.
The totally phosphor free finish is bio-compatible, consuming less energy and water than ENIG (Electroless Nickel/Immersion Gold), ENEPIG and Immersion Tin finishes. Its operating temperatures are lower than competitive final finish processes.
Features and benefits include:
EPAG and EPIG (Electroless Palladium/Immersion Gold) are basically the same finish, but with the auto-catalytic gold you can get a higher gold thickness on the electroless palladium - so it can be used for more assembly techniques, such as gold wire bonding as well as soldering - therefore it is a more universal finish. GSPK Circuits and Atotech are effectively working together for 20 years and made some major developments together.
Steve Lloyd, managing director (pictured) said: “The industry has been crying out for a solution like this to be readily available in the UK and it’s great that we can lead the way.”